英语翻译摘要：本文研究了添加比重为0.3%、0.5%、0.7%纳米TiO2颗粒对SnAgCu无铅钎料的组织、熔点、显微硬

英语翻译
摘要：本文研究了添加比重为0.3%、0.5%、0.7%纳米TiO2颗粒对SnAgCu无铅钎料的组织、熔点、显微硬度和钎料接头力学性能的影响,结果表明,纳米TiO2颗粒的添加明显细化了钎焊组织,改善了钎焊接头的力学性能和热稳定性能.其中添加0.5%纳米TiO2颗粒的复合钎料具有最优的综合性能,与SnAgCu无铅钎料相比,熔点降低1.7℃,接头界面的金属间化合物（IMC）层厚度约为4.9μm,相比于SAC钎料（9μm）显著减小,抗拉强度和抗剪强度分别为69.3MPa和72.6MPa,分别提高了26.7%和21.2%.
关键词：纳米二氧化钛无铅钎料金属间化合物强度

chicheng2005 1年前已收到1个回答举报

welsend 幼苗

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This paper studies the adding proportion is 0.3%,0.5%,0.7% of TiO2 nano particles on the microstructure of SnAgCu solder,melting point,hardness and mechanical properties of solder joint effects,the results show that,TiO2 nano particles added obviously refines the microstructure of brazed brazing joint,improve the mechanical properties and thermal stability.The comprehensive performance of which added 0.5% TiO2 nanoparticlescomposite solder has the best,compared with the SnAgCu lead-free solder,low melting point 1.7 C,joint interface intermetallic compound (IMC) layer thickness is about 4.9 m,compared to SAC solder (9 m) significantly decreased,tensile strength and shear strength are 69.3MPa and 72.6MPa,were increased by 26.7% and 21.2%.
Keywords:compound strength of nano titanium dioxide lead-free solderintermetallic

1年前

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